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Tower Semiconductor adopts Legend’s CharFlo-Memory! for quality
assurance of commercially available memory compilers
SANTA CLARA, Calif., --December 15,
2003 - Legend Design Technology, Inc. today announced that
semiconductor foundry Tower Semiconductor (NASDAQ: TSEM; TASE: TSEM)
has adopted CharFlo-Memory! to implement a quality assurance (QA)
methodology for commercially available memory compilers. Based upon
layout-extracted circuit data with resistors and capacitors,
Legend’s CharFlo-Memory! toolset has the capacity to generate
accurate on-chip memory instance models at any PVT (process, voltage
and temperature) corner. The results enable Tower to offer its
clients the highest quality product possible.
“System-on-chip
(SoC) designs are becoming increasingly memory dominant as silicon
technology rapidly moves to deep sub-micron and nanometer levels.
Tower Semiconductor has put in place a memory quality assurance (QA)
flow that minimizes the growing gap between the foundry and IP
provider, and enables our customers to achieve time-to-market goals
for their SOC designs. We have successfully used Legend tools to QA
our wide portfolio of memory compilers from leading IP vendors.
Tower Semiconductor uses Legend’s memory characterization tool,
CharFlo-Memory!, to efficiently produce memory models that reflect
the reality of the silicon. We are dedicated to the overall
quality of our design services and the means to achieve the highest
levels of customer satisfaction," said Sergio Kusevitzky, vice
president of design services and IP at Tower
Semiconductor.
“For the ‘what-if’ analysis on any PVT
(process, voltage and temperature) corner, Legend’s CharFlo-Memory!
has automated the characterization task and accomplished it
accurately and efficiently. Tower Semiconductor now has the
means to easily verify the impact that a process change might have
on memory IP function. In addition, Legend’s high-accuracy
circuit simulator MSIM, which is seamlessly integrated with
CharFlo-Memory!, has provided excellent performance and results,”
added Kusevitzky.
"Quality and reliability of embedded memory is essential for
silicon success of deep-submicron and nanometer SOC designs," said
You-Pang Wei, president and chief executive officer of Legend Design
Technology. "With the adoption of Legend’s Charflo-Memory!, Tower
has acquired the leading-edge solution for memory IP quality
assurance and verification. We’re pleased to be working closely with
Tower in meeting their needs for supporting their clients’
state-of-the-art SOC designs.”
About Legend Design Technology,
Inc. Legend Design Technology, Inc. is a leading provider
of characterization and simulation software for semiconductor
Intellectual Property (IP) in SoC designs. With an emphasis on
productivity and value, Legend’s CharFlo-Memory! toolset which
includes MSL, SpiceCut, MemChar and MSIM, efficiently and accurately
automate the time consuming and error prone processes associated
with characterization. SpiceCut automatically builds critical-path
circuits to reduce simulation time for characterization, especially
from post-layout extracted circuits with resistors and capacitors.
MemChar automatically characterizes the memories and generates the
‘true’ timing and power models. MSL automates memory
characterization with customized setup of '.Lib-in and .Lib out'.
MSIM is a highly accurate characterization-oriented circuit
simulator with post-layout RC reduction capacity. For more
information, visit http://www.us.design-reuse.com/exit?url=http://www.LegendDesign.com
About Tower Semiconductor,
Ltd. Tower Semiconductor Ltd. is a pure-play independent
wafer foundry established in 1993. The company manufactures
integrated circuits with geometries ranging from 1.0 to 0.18
microns; it also provides complementary manufacturing services and
design support. In addition to digital CMOS process technology,
Tower offers advanced non-volatile memory solutions, mixed-signal
and CMOS image-sensor technologies. To provide world-class customer
service, the company maintains two manufacturing facilities. Fab 1
has process technologies from 1.0 to 0.35 microns and can produce up
to 16,000 150mm wafers per month. Fab 2 features 0.18-micron and
below process technologies, including foundry-standard technology,
and will offer full production capacity of 33,000 200mm wafers per
month. The Tower Web site is located at http://www.us.design-reuse.com/exit?url=http://www.towersemi.com.
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